DC Magnetron Sputering
Cylindrical Geometry
Plasma sputtering is a well known technique for preparation of thin films on various substrates. In this method the atoms and clusters are ejected from the target’s surface by ion impact and deposited on the substrate. In our laboratory there are two cylindrical DC magnetron sputtering systems in both research and semi-industrial size. These facilities were designed and constructed in Plasma Physics Research Center in 2002
Systems properties
| Research Scale | semi- industrial | |
| N2,Ar | N2,Ar | Chamber Gases |
| 500mA | 2A | Discharge Current |
| 5KV | 5KV | Discharge Voltage |
| 400G | 650G | Magnetic Field Intensity |
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Flat Geometry
A flat DC magnetron sputtering system was designed and built in 2009. This system is used for sputter coating of different kinds of metals such as Ta, Ni, Ti, Al, Cu, Au... On various substrates. substratetempraturecontrolability to 500oC, gas mixer to control
the gas inflow were designed and added to this system
